P.V. Nano Cell Ltd. announced that it has successfully printed and tested high-demanding parts that include printing inside challenging VIA - vertical interconnect access. VIA are used as an electrical connection between layers (or sides of substrate) in a physical electronic circuit that goes through the plane of one or more adjacent layers. PV Nano Cell was able to print inside VIA with a diameter of 0.6 mm (0.024 inch) and a height of 1 mm (0.04 inch). A phenomenal, minimal resistance of 0.1 ohms was measured and the company said it could print smaller sized VIA as well. One side of the substrate is printed a pattern consisting of multiple widths and thicknesses (heights) of conductive features. This pattern forms an accurate resistor that heats to high temperature in less than milliseconds.