eSep, Inc announced that it will receive a round of funding on June 28, 2024.

On the same date, the company has received ¥660,000,000 in its first tranche. The series B round of funding included participation from new investors, Nittoseiko Co.,Ltd., Hiroshima Venture Capital Co., Ltd., and returning investor, Mitsui Kinzoku-SBI Material Innovation Fund, a fund managed by SBI Investment Co., Ltd.. The company raised funding through a third-party allotment of new shares. The transaction is expected to close around the end of September 2024.