The company's board of directors resolved
to convene the 2022 shareholders' meeting
Date of events
2022/03/17
To which item it meets
paragraph 17
Statement
1.Date of the board of directors' resolution:2022/03/17
2.Shareholders meeting date:2022/06/10
3.Shareholders meeting location:5F, NO.5-1, South 2nd Road, Tanzi Dist.
Taichung City, Taiwan.
4.Shareholders meeting will be held by means of (physical shareholders
meeting/ visual communication assisted shareholders meeting /
visual communication shareholders meeting):physical shareholders' meeting.
5.Cause for convening the meeting (1)Reported matters:
1.2021 Business Report.
2.Report by Audit Committee on the examination of 2021 financial statements.
3.Report on the condition of the company's endorsement and guarantees
for other company.
4.2021 remuneration for employees and directors.
5.Report on the amendments to the company's "Code of Corporate
Social Responsibility".
6.Report on the amendments to the company's "Procedures for Share
Buy-back and Transfer to Employees".
7.Other matters to be reported.
6.Cause for convening the meeting (2)Acknowledged matters:
1.Acknowledge of 2021 business report and financial statements.
2.Acknowledge of 2021 earning distribution.
7.Cause for convening the meeting (3)Matters for Discussion:
1.Discussion of amendments to the company's "Articles of Incorporation ."
2.Discussion of amendments to the company's "Procedures for Acquisition
and Disposal of Assets ."
3.Discussion of amendments to the company's "The Rules of Procedure for
Shareholders' Meetings."
8.Cause for convening the meeting (4)Election matters:
To elect the company's 20th term of directors.
9.Cause for convening the meeting (5)Other Proposals:
Discussion to approve the lifting of non-competition restrictions on
directors.
10.Cause for convening the meeting (6)Extemporary Motions:None.
11.Book closure starting date:2022/04/12
12.Book closure ending date:2022/06/10
13.Any other matters that need to be specified:None.
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Lingsen Precision Industries Ltd. published this content on 17 March 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 17 March 2022 09:40:03 UTC.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
LINGSEN PRECISION INDUSTRIES, LTD. 
