Lingsen Precision Industries, Ltd.

Equities

2369

TW0002369006

Semiconductor Equipment & Testing

End-of-day quote Taiwan S.E. Other stock markets 03:30:00 28/06/2024 am IST			5-day change	1st Jan Change
23.65 ^TWD	+1.28%		+2.38%	+3.28%

13/06	Lingsen Precision Industries, Ltd. Announces Change of Research and Development Officer	CI
30/05	Lingsen Precision Industries, Ltd. Announces Cash Dividend, Payable on August 28, 2024	CI

Lingsen Precision Industries, Ltd. Announces Change of Research and Development Officer

June 13, 2024 at 02:20 pm IST

Lingsen Precision Industries, Ltd. announced change of research and development officer. Name, title, and resume of the previous position holder: Ming-Te Tu, Vice President of R&D Engineering Division. Name, title, and resume of the new position holder: Yu-Cheng Lin, Director of R&D Engineering Division Effective date: July 1, 2024.

Latest news about Lingsen Precision Industries, Ltd.

Lingsen Precision Industries, Ltd. Announces Change of Research and Development Officer	13/06	CI
Lingsen Precision Industries, Ltd. Announces Cash Dividend, Payable on August 28, 2024	30/05	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2024	08/05	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2023	29/02	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	07/11	CI
Lingsen Precision Industries, Ltd. announced that it expects to receive $3 million in funding	13/23/13	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	07/23/07	CI
Lingsen Precision Industries, Ltd. Announces Cash Dividend, Payable on August 25, 2023	30/23/30	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2023	10/23/10	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022	01/23/01	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	07/22/07	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	09/22/09	CI
Lingsen Precision Industries, Ltd. announced that it expects to receive $1 million in funding	21/22/21	CI
Lingsen Precision Industries, Ltd. Announces Cash Dividend, Payable on August 31, 2022	20/22/20	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2022	06/22/06	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2021	18/22/18	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	06/21/06	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2021	06/21/06	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2020	19/21/19	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Third Quarter Ended September 30, 2020	12/20/12	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Second Quarter Ended June 30, 2020	05/20/05	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the First Quarter Ended March 31, 2020	05/20/05	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2019	18/20/18	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Third Quarter Ended September 30, 2019	08/19/08	CI
Lingsen Precision Industries, Ltd. Reports Earnings Results for the Second Quarter Ended June 30, 2019	07/19/07	CI

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Company Profile

LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.

Sector

Semiconductor Equipment & Testing

Calendar

05/08/2024 - Q2 2024 Earnings Release (Projected)

More about the company

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Semiconductor Testing Equipment & Service