Inari Amertron Berhad is a Malaysia-based company that is engaged in the investment holding and the provision of management services. The Company operates as an outsourced semiconductor assembly and test (OSAT) service provider for radio frequency, fiber-optics transceivers, opto-electronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed, and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include new product introduction (NPI) services, sensor and IC package design and characterization.
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