Globetronics Technology Bhd.

GTRONIC

MYL7022OO006

Semiconductors

End-of-day quote BURSA MALAYSIA Other stock markets 03:30:00 07/06/2024 am IST			5-day change	1st Jan Change
1.45 ^MYR	-1.36%		+17.89%	-10.49%

04/06	Globetronics Technology Bhd. Announces Resignation of P'ng Chiew Keem as Joint Secretary	CI
04/06	Globetronics Technology Bhd. Announces Resignation of Lee Peng Loon as Joint Secretary	CI

Globetronics Technology Bhd Announces a Single Tier Special Dividend for the Year Ended 31 December 2022, Payable on 23 March 2023

February 23, 2023 at 03:05 pm IST

Globetronics Technology Bhd announced a single tier special dividend of 1 sen per ordinary share for the year ended 31 December 2022. Ex-Date is 10 March 2023. Entitlement date is 13 March 2023.

Payment date is 23 March 2023.

Latest news about Globetronics Technology Bhd.

Globetronics Technology Bhd. Announces Resignation of P'ng Chiew Keem as Joint Secretary	04/06	CI
Globetronics Technology Bhd. Announces Resignation of Lee Peng Loon as Joint Secretary	04/06	CI
Globetronics Technology Bhd. Announces Change of Registered Office Address	04/06	CI
Globetronics Technology Bhd. Announces Retirement of Ng Kok Choon as Executive Non-Independent Director	10/05	CI
Globetronics Technology's Profit Rises in Q1 Despite Revenue Drop	09/05	MT
Globetronics Technology Bhd Appoints Chiew Jong Wei as Independent and Non Executive Chairman of Audit Committee	05/04	CI
Globetronics Technology Bhd. Appoints Tan Teik Hsiung as Independent and Non Executive Member of Audit Committee	05/04	CI
Globetronics Technology Bhd appoints Dato' Sri Zaini Bin Jass as Independent and Non Executive Member of Nomination Committee	05/04	CI
Globetronics Technology Bhd. Announces the Appointment of Gan Sheng Yih as Independent and Non Executive Member of Remuneration Committee	05/04	CI
Globetronics Technology Bhd. Appoints Dato' Sri Zaini Bin Jass as Independent and Non Executive Member of Remuneration Committee	05/04	CI
Globetronics Technology Bhd. Appoints Tan Teik Hsiung as Independent and Non Executive Chairman of Nomination Committee	05/04	CI
Globetronics Technology Bhd Appoints Gan Sheng Yih as Independent and Non Executive Member of Nomination Committee	05/04	CI
Globetronics Technology Bhd. Announces the Appointment of Tan Teik Hsiung as Independent and Non Executive Chairman of Remuneration Committee	05/04	CI
Globetronics Technology Bhd. appoints Dato' Sri Zaini Bin Jass as Independent and Non Executive Member of Audit Committee	05/04	CI
Globetronics Technology Bhd. Appoints Tan Tong Lang as Joint Secretary	12/03	CI
Globetronics Technology, Kaynes Semicon Enter $7.6 Million Technology Provision Deal	07/03	MT
Globetronics Technology Bhd. Announces A Single Tier Third Interim Dividend for the Year Ended 31 December 2023, Payable on 22 March 2024	23/02	CI
Globetronics Technology Bhd. Announces Single Tier Special Dividend for the Year Ended 31 December 2023, Payable on 22 March 2024	23/02	CI
Globetronics Technology Bhd. Announces Resignation of Madam Ong Huey Min as Independent and Non Executive Director	21/02	CI
Globetronics Technology Bhd. Announces Resignation of Khoo Kay Leong as Independent and Non Executive Director	21/02	CI
Globetronics Technology Bhd. Announces Resignation of Mr. Ng Kok Khuan as Non Independent and Non Executive Director	21/02	CI
Globetronics Technology Bhd. Announces Resignation of Ng Kok Yu as Executive Chairman	21/02	CI
Globetronics Technology Bhd. Appoints Tan Teik Hsiung as Independent and Non Executive Director	21/02	CI
Globetronics Technology Bhd. Announces Resignation of Tuan Haji Mohammad Hazani Bin Hj Hassan as Independent and Non Executive Director	21/02	CI
Globetronics Technology Bhd. Announces Resignation of Ong Huey Min as Independent and Non Executive Member of Remuneration Committee	21/02	CI

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Globetronics Technology Bhd. is a Malaysia-based investment holding company. The Company is principally involved in the manufacture, assembly, testing and sale of integrated circuits, optoelectronic products, small outline components, light-emitting-diode (LED) components and modules, sensors and optical products, electronics/semiconductor components and technical plating services for the semiconductor and electronics industries. Its manufacturing capabilities include die sawing, auto die sorting, auto pure tin and tin bismuth plating, auto die attach, wire bonding, and automatic optical inspection. It provides various products and services, such as semiconductor; LED, encoder and sensor; quartz crystal and timing devices; chemical and IDM supplier, and IT solutions and services. The Company's manufacturing activities are performed in Malaysia, and its sales and distribution activities are performed in two principal geographical areas, namely Southeast Asia and North America.

Sector

Semiconductors

Calendar

23/07/2024 - Q2 2024 Earnings Release (Projected)

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Ratings for Globetronics Technology Bhd.

Trading Rating

Investor Rating

ESG Refinitiv

C-

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Analysts' Consensus

Sell

Buy

Mean consensus

UNDERPERFORM

Number of Analysts

Last Close Price

1.45 MYR

Average target price

1.188 MYR

Spread / Average Target

-18.10%

Consensus

EPS Revisions

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Annual profits - Rate of surprise

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