Chipbond Technology Corporation

6147

TW0006147002

Semiconductors

End-of-day quote Taipei Exchange Other stock markets 03:30:00 28/06/2024 am IST			5-day change	1st Jan Change
67.1 ^TWD	-0.30%		-1.47%	-7.19%

08/05	Chipbond Technology Corporation Announces Cash Dividend, Payable on June 14, 2024	CI
08/05	Chipbond Technology Corporation Announces Promotion of Huoo-Wen Gau as CEO	CI

Chipbond Technology Corporation Announces Cash Dividend, Payable on June 14, 2024

May 08, 2024 at 11:12 am IST

Chipbond Technology Corporation announced cash dividend of TWD 3.75 per share or TWD 2,792,533,271. Ex-rights (Ex-dividend) date is May 23, 2024, Ex-rights (Ex-dividend) record date is May 29, 2024. Payment date of cash dividend distribution is June 14, 2024.

Latest news about Chipbond Technology Corporation

Chipbond Technology Corporation Announces Cash Dividend, Payable on June 14, 2024	08/05	CI
Chipbond Technology Corporation Announces Promotion of Huoo-Wen Gau as CEO	08/05	CI
Chipbond Technology Corporation Announces President Changes	08/05	CI
Chipbond Technology Corporation Announces Audit Committee Members Changes	30/04	CI
Chipbond Technology Corporation Reports Earnings Results for the First Quarter Ended March 31, 2024	26/04	CI
E Ink Holdings Inc. Teams Up with Realtek Semiconductor, Integrated Solutions Technology and Chipbond Technology Corporation to Develop Next-Generation ePaper Shelf Labels	15/04	CI
Chipbond Technology Corporation Reports Earnings Results for the Full Year Ended December 31, 2023	22/02	CI
Chipbond Technology Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	27/23/27	CI
Chipbond Technology Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	28/23/28	CI
Chipbond Technology Corporation Announces Cash Dividend, Payable on July 14, 2023	01/23/01	CI
Chipbond Technology Corporation Reports Earnings Results for the First Quarter Ended March 31, 2023	27/23/27	CI
Chipbond Technology Corporation Reports Earnings Results for the Full Year Ended December 31, 2022	24/23/24	CI
Chipbond Technology Corporation Announces Resignation of Fei-Jain Wu as CEO	23/22/23	CI
Chipbond Technology Corporation Acquires Batch of TWD 500 Million Machinery Equipment	02/22/02	CI
Chipbond Technology Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	29/22/29	CI
Chipbond Technology Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022	30/22/30	CI
Hua Chen Investment Co., Ltd agreed to acquire a.604054% stake in Chipbond Technology Corporation for approximately HKD 300 million.	15/22/15	CI
Chipbond Technology Corporation announced that it expects to receive TWD 300.87266 million in funding from Hua Chen Investment Co., Ltd	15/22/15	CI
Chipbond Technology Corporation Announces the Cash Dividend, Payable on August 12, 2022	17/22/17	CI
Chipbond Technology Corporation Appoints Oliver Chang as Institutional Director	27/22/27	CI
Chipbond Technology Corporation Reports Earnings Results for the First Quarter Ended March 31, 2022	30/22/30	CI
Chipbond Technology Corporation Reports Earnings Results for the Full Year Ended December 31, 2021	01/22/01	CI
Chipbond Technology Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021	27/21/27	CI
United Microelectronics : Tech Stocks Rise As Investors Chase Growth After August Jobs Report Disappoints	04/21/04	MT
Sector Update: Tech	04/21/04	MT

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Company Profile

Chipbond Technology Corp is a Taiwan-based company principally engaged in the research, development, manufacture, and distribution of electronic and semiconductor products, as well as the provision of related testing and assembling services. The Company provides products include gold bumps, solder bumps, chip on glass (COG), chip on film (COF) and flip chip and tape carrier packaging (TCP) products, among others. Its products are mainly used in the manufacture of computers, workstations, mobile phones, network products, air bag controllers, engine controlling components, automatic brake systems (ABSs), automobile air conditioners, digital cameras, watches, and liquid crystal display (LCD) monitors. The Company mainly distributes its products in Taiwan, the United States of America (the USA) and other regions.

Sector

Semiconductors

Calendar

25/07/2024 - Q2 2024 Earnings Release (Projected)

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Ratings for Chipbond Technology Corporation

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Analysts' Consensus

Sell

Buy

Mean consensus

UNDERPERFORM

Number of Analysts

Last Close Price

67.1 TWD

Average target price

63.24 TWD

Spread / Average Target

-5.75%

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