CHIPBOND TECHNOLOGY CORPORATION

Press Releases Chipbond Technology Corporation

Equities

6147

TW0006147002

End-of-day quote Taipei Exchange Other stock markets 03:30:00 28/06/2024 am IST			5-day change	1st Jan Change
67.1 ^TWD	-0.30%		-1.47%	-7.19%

08/05	Chipbond Technology Corporation Announces Cash Dividend, Payable on June 14, 2024	CI
08/05	Chipbond Technology Corporation Announces Promotion of Huoo-Wen Gau as CEO	CI

Press Releases

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E Ink ecosystem partnerships to develop next-gen ePaper shelf labels	16/04	AQ
Chipbond Technology : The Company announced Board has approved Q2 of 2022 consolidated financial report	29/22/29	PU
Chipbond Technology : To announce Chairman of the Company set up the ex-dividend record date.	17/22/17	PU
Chipbond Technology : To announce the Company acquires a batch of NT$500 million machinery equipment	09/22/09	PU
Chipbond Technology : The Company announced Board has approved Q1 of 2022 consolidated financial report	29/22/29	PU
Chipbond announces supplemental information on 2022 Annual General Shareholders' Meeting (Method of Convening the Meeting: Physical Shareholders' Meeting)	15/22/15	PU
Chipbond Technology : Board Meeting Resolution on dividend distribution	15/22/15	PU
Chipbond Technology : To announce the Company acquires a batch of NT$500 million machinery equipment	22/22/22	PU
Chipbond Technology : The Company announced Board has approved Q4 of 2021 consolidated financial report	25/22/25	PU
Chipbond Technology : Board of Directors resolved to convene 2022 Annual Shareholders' Meeting	25/22/25	PU

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