CAP-XX provided an update on two new important products that continue to be developed and have the potential to make a significant impact on the supercapacitor industry as well as opening new markets for CAP-XX. The first is the DMH Prismatic Series which are pouch supercapacitors, less than 500 microns thick, developed for the consumer electronics industry. The second is the SMT Cylindrical Series, a class of cylindrical supercapacitors utilising the Company's unique surface mount technology ("SMT").

This product can go throw a reflow oven; transforming the industry which currently uses wave or hand soldering.   Progress with the DMH Prismatic Series:   CAP-XX reported that samples are now ready for customer evaluation. In tandem with this, the Company will continue to commission production equipment, including downstream equipment for inline device testing for quality control.

CAP-XX has been commissioning a new production line for the manufacture of very thin supercapacitors that are less than 500 microns thick. This new product, branded the DMH series and measuring 20mm x 20mm x 0.4mm, is far thinner than any other supercapacitor currently available on the market. The DMH supercapacitor will be a unique offering to customers, providing a thin form factor whilst maintaining extremely high-power performance.

The DMH cells connected in series can provide a peak current of 5 amps with an operating voltage of 4.2V, a significant power output for such a small device. There are significant market opportunities for the DMH product in applications such as smart cards and wearable devices, where a thin form factor is a crucial requirement.     CAP-XX has already announced that a pre-series batch of DMH parts has been fabricated on its assembly equipment which includes the steps of laminate forming, electrode stacking, empty cell forming, electrolyte filling and sealing. The initial laboratory evaluation of the pre-series batch is now complete and shows trial parts successfully passed endurance specifications for 1000 hours at 70°C and rated voltage.

The testing of the first pre series batch has shown CAP-XX can produce parts on the assembly equipment and samples are now ready for customer evaluation.  The next stage is to continue commissioning of production equipment, including downstream equipment for inline device testing for quality control. Progress with the SMT Cylindrical Series: CAP-XX reported that it has successfully completed trials at an outside facility using a production reflow oven using high temperature solder paste. CAP-XX's SMT supercapacitors were successfully soldered onto a printed circuit board, had excellent mechanical attachment, and exhibited good electrical functionality after the reflow process.

Full endurance testing of the newly reflow soldered parts are underway. CAP-XX has made considerable progress in the development of its new cylindrical surface mount technology. SMT will be a unique product in the market for small supercapacitors with capacitances ranging from 0.1F to 20F.

The SMT will allow supercapacitors to be soldered onto printed circuit boards ("PCBs") using the reflow oven process which is the preferred industry method for the manufacture of PCBs. Apart from taking market share from existing supercapacitor sales, the Board believes the SMT will accelerate the growth in supercapacitor sales by eliminating a key barrier for technology uptake for many potential high-volume customers.