Advanced Microelectronic Products Inc. (GTSM:6287) announced a private placement of 1,000 third private unsecured convertible corporate bonds at TWD 100,000 per bond for gross proceeds of TWD 100,000,000 on August 3, 2017. The transaction will include participation from existing investor Advanced Semiconductor Engineering, Inc. (TSEC:2311). The bonds are issued at par value.

The transaction is subject to be approved by the board of the investor on August 11, 2017.