Molex Incorporated has expanded its EdgeLine® portfolio with the addition of its new, high-speed edge card connectors. These low-profile, one-piece products feature a high-speed differential contact design that enables speeds of up to 25 Gbps with excellent signal integrity. The products are the latest addition to the EdgeLine family, which provides cost-effective, flexible and scalable solutions for low-to-mid range telecommunications, computing and storage applications. Molex will feature the EdgeLine High-Speed Edge Card Connectors, as well as other EdgeLine products, at DesignCon 2014, January 29 - 30, Santa Clara, CA, booth 117.

"As systems become more complex, customers not only require higher data rates and superior signal transmission clarity, but also greater levels of interconnectivity within limited board space," said Adam Stanczak, product development manager, Molex. "The latest EdgeLine connectors address the need for a reliable, high-speed, one-piece solution while continuing to provide the ultimate in design flexibility with compact density and minimal PCB footprint real estate."

The connectors can accommodate PCB thicknesses of 1.57 to 3.18mm, making them ideal for intricate product designs. They are available in multiple circuit sizes for greater design flexibility for signal and power assignments in one solution. The connectors also feature low-profile heights for enhanced airflow and thermal management, with the CoPlanar measuring 6.40mm above the PCB and the CoEdge at 3.50mm above and below the PCB.

Other features include:

  • Press-fit, compliant-pin terminal design for easy board termination using flat-rock tooling and SMT attach for higher speed capability
  • Cost-effective stitched terminal to accommodate various signal and power requirements
  • Common or singulated ground which offers flexibility for power, slow-speed, single-ended signals and high-speed differential circuits
  • Center key on certain circuit sizes improves the PCB alignment during mating by centering the mating edge within the socket interface
  • Keying and locking features on the 0.80mm pitch CoEdge connectors secure it to the PCB and improve board alignment during mating. A secondary locking option helps prevent accidental unmating and prohibits the PCB from backing out of connector

For more information about the EdgeLine family of connectors, please visit www.molex.com/link/edgeline.html. To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at http://www.molex.com/link/register.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including: data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicle, aerospace and defense, medical, and lighting. Established in 1938, the company operates 45 manufacturing locations in 17 countries. The Molex website is www.molex.com. Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.

Molex is a registered trademark of Molex Incorporated

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Christa Carroll, 630.408.9164
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Larry Wegner, 630.527.2650
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