Kai Leung Chan

UboT, Inc. Ltd. engages in production of trays. Its Products and services include JEDEC Tray and tray recycling services. The company was founded in 2005 and is headquartered in Hong Kong.

UBoT Holding Ltd. is a holding company, which engages in the manufacture of engineering plastics. It operates through the Back-End Semiconductor Transport Media and MEMS and Sensor Packaging Solutions segments. The Back-End Semiconductor Transport Media segment refers to the manufacturing and sale of back-end semiconductor transport media products, including JEDEC tray, carrier tape and other accessories. The MEMS and Sensor Packaging Solutions segment includes manufacturing and sale of MEMS and sensor products packages. The company was founded on February 7, 2022 and is headquartered in Hong Kong.

UboT, Inc. Ltd. engages in production of trays. Its Products and services include JEDEC Tray and tray recycling services. The company was founded in 2005 and is headquartered in Hong Kong.

UBoT Holding Ltd. is a holding company, which engages in the manufacture of engineering plastics. It operates through the Back-End Semiconductor Transport Media and MEMS and Sensor Packaging Solutions segments. The Back-End Semiconductor Transport Media segment refers to the manufacturing and sale of back-end semiconductor transport media products, including JEDEC tray, carrier tape and other accessories. The MEMS and Sensor Packaging Solutions segment includes manufacturing and sale of MEMS and sensor products packages. The company was founded on February 7, 2022 and is headquartered in Hong Kong.

UboT, Inc. Ltd. engages in production of trays. Its Products and services include JEDEC Tray and tray recycling services. The company was founded in 2005 and is headquartered in Hong Kong.

UBoT Holding Ltd. is a holding company, which engages in the manufacture of engineering plastics. It operates through the Back-End Semiconductor Transport Media and MEMS and Sensor Packaging Solutions segments. The Back-End Semiconductor Transport Media segment refers to the manufacturing and sale of back-end semiconductor transport media products, including JEDEC tray, carrier tape and other accessories. The MEMS and Sensor Packaging Solutions segment includes manufacturing and sale of MEMS and sensor products packages. The company was founded on February 7, 2022 and is headquartered in Hong Kong.

UBoT Holding Ltd. is a holding company, which engages in the manufacture of engineering plastics. It operates through the Back-End Semiconductor Transport Media and MEMS and Sensor Packaging Solutions segments. The Back-End Semiconductor Transport Media segment refers to the manufacturing and sale of back-end semiconductor transport media products, including JEDEC tray, carrier tape and other accessories. The MEMS and Sensor Packaging Solutions segment includes manufacturing and sale of MEMS and sensor products packages. The company was founded on February 7, 2022 and is headquartered in Hong Kong.

UboT, Inc. Ltd. engages in production of trays. Its Products and services include JEDEC Tray and tray recycling services. The company was founded in 2005 and is headquartered in Hong Kong.

UBoT Holding Ltd. is a holding company, which engages in the manufacture of engineering plastics. It operates through the Back-End Semiconductor Transport Media and MEMS and Sensor Packaging Solutions segments. The Back-End Semiconductor Transport Media segment refers to the manufacturing and sale of back-end semiconductor transport media products, including JEDEC tray, carrier tape and other accessories. The MEMS and Sensor Packaging Solutions segment includes manufacturing and sale of MEMS and sensor products packages. The company was founded on February 7, 2022 and is headquartered in Hong Kong.

UBoT Holding Ltd. is a holding company, which engages in the manufacture of engineering plastics. It operates through the Back-End Semiconductor Transport Media and MEMS and Sensor Packaging Solutions segments. The Back-End Semiconductor Transport Media segment refers to the manufacturing and sale of back-end semiconductor transport media products, including JEDEC tray, carrier tape and other accessories. The MEMS and Sensor Packaging Solutions segment includes manufacturing and sale of MEMS and sensor products packages. The company was founded on February 7, 2022 and is headquartered in Hong Kong.