![Jung Huang Li](https://cdn.zonebourse.com/static/resize/768/576//static/images/insiders/unknown.png)
Network origin in Jung Huang Li first degree
Entity | Entity type | Industry | |
---|---|---|---|
Public Company | Specialty Telecommunications | 5 |
Chart of Companies connected to the second degree
Multi-company connection
Companies connected to Jung Huang Li via their personal network
Company | Sector | Related people | Main position |
---|---|---|---|
SILICONWARE PRECISION INDUSTRIES CO, LTD | Semiconductors | Sales & Marketing | |
Tatung University | College/University | Doctorate Degree | |
University of Florida | College/University | Doctorate Degree | |
University of Tamkang | College/University | Undergraduate Degree | |
National Tsing-Hua University | College/University | Graduate Degree | |
SENTELIC CORPORATION | Semiconductors | Chief Executive Officer | |
CHIEF LAND ELECTRONIC CO LTD | Electronic Components | Director/Board Member | |
National Taiwan University of Science & Technology | College/University | Undergraduate Degree | |
JSW PACIFIC CORPORATION | Telecommunications Equipment | Director/Board Member | |
Brickcom Corp. (TW)
![]() Brickcom Corp. (TW) Telecommunications EquipmentElectronic Technology Brickcom Corp. is a private company based in Hsinchu, Taiwan. The Taiwanese company specializes in IP surveillance and smart home solutions. The company's products are protected by copyright and they can be contacted at info@brickcom.com. | Telecommunications Equipment | Director/Board Member | |
China Radio Association | Chairman | ||
ANJI TECHNOLOGY CO., LTD. | Semiconductors | Director/Board Member | |
BUIMA GROUP INC. | Building Products | Director/Board Member | |
KEDING ENTERPRISES CO., LTD. | Forest Products | Director/Board Member | |
Siliconware Electronics (Fujian) Co., Ltd.
![]() Siliconware Electronics (Fujian) Co., Ltd. SemiconductorsElectronic Technology Siliconware Electronics (Fujian) Co., Ltd. engages in the manufacture of semiconductors and related devices. Its products include multi-package, stacked die, chip-scale package, and ball grid array integrated circuits. The company was founded on July 19, 2017 and is headquartered in Quanzhou, China. | Semiconductors | Director/Board Member |
Statistics
International
Taiwan | 12 |
China | 3 |
United States | 2 |
Cayman Islands | 2 |
Sectoral
Electronic Technology | 8 |
Consumer Services | 6 |
Producer Manufacturing | 2 |
Non-Energy Minerals | 2 |
Operational
Director/Board Member | 13 |
Independent Dir/Board Member | 8 |
Undergraduate Degree | 2 |
Doctorate Degree | 2 |
Sales & Marketing | 1 |
Most connected contacts
Insiders | |
---|---|
Chun Jen Cheng | 7 |
Yu Chih Yue | 4 |
Chao Yun Hsu | 4 |
Yuan Tzu Ting | 3 |
Chang Cheng Chen | 2 |
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