Network origin in David McComb first degree
| Entity | Entity type | Industry | |
|---|---|---|---|
FlipChip International LLC
 FlipChip International LLC SemiconductorsElectronic Technology FlipChip International LLC provides wafer bumping and wafer level packaging semiconductor services. The firm’s services include wafer level services, probing, backgrind, decing, packing, solder alloy, and many more. It also offers wafer thinning, electrical test, and dicing. The company was founded in 1996 and is headquartered in Phoenix, AZ.
12
| Subsidiary | Semiconductors | 12 |
Chart of Companies connected to the second degree
Multi-company connection
Companies connected to David McComb via their personal network
| Company | Sector | Related people | Main position |
|---|---|---|---|
| National University of Singapore | College/University | Undergraduate Degree | |
| UNISEM (M) | Semiconductors | Director/Board Member | |
| SUNEDISON INC | Alternative Power Generation | Corporate Officer/Principal | |
| FTC SOLAR, INC. | Packaged Software | Corporate Officer/Principal | |
| TIANSHUI HUATIAN TECHNOLOGY CO., LTD. | Semiconductors | Director/Board Member | |
Unisem Advanced Technologies Sdn. Bhd.
 Unisem Advanced Technologies Sdn. Bhd. SemiconductorsElectronic Technology Unisem Advanced Technologies Sdn. Bhd. manufactures electron tubes and semiconductors. Its services include gold bumping, electroplated solder bumping, electroplated copper pillar bumping, large solder bumping, PBO, polyimides & BCB passivation, redistribution of bond pads and in-house photo mask and stencil design capability. The company was founded on September 13, 2004 and is headquartered in Perak, Malaysia. | Semiconductors | Director/Board Member | |
Xiamen Yonghong Group Co. Ltd.
 Xiamen Yonghong Group Co. Ltd. SemiconductorsElectronic Technology Xiamen Yonghong Group Co., Ltd. manufactures and distributes semi conductor lead frames. It also provides precise tooling products. The company distributes products to United States and other European countries. Xiamen Yonghong Group is located in Xiamen, China | Semiconductors | Corporate Officer/Principal | |
Huatian Technology (Kunshan) Electronics Co. Ltd.
 Huatian Technology (Kunshan) Electronics Co. Ltd. Electronic Production EquipmentElectronic Technology Huatian Technology (Kunshan) Electronics Co. Ltd. develops and manufactures electronic components. Its products include bumping service, TSV service and WLCSP service. The company was founded in June 2008 and is headquartered in Kunshan, China. | Electronic Production Equipment | Chief Executive Officer | |
| Adelphi University | College/University | Masters Business Admin | |
| Fudan University | College/University | Doctorate Degree | |
| Dna Asset Management LLC | Chairman | ||
| The University of Edinburgh | College/University | Undergraduate Degree | |
| Harvard Law School | College/University | Graduate Degree | |
| SERCOMM CORPORATION | Telecommunications Equipment | Director/Board Member | |
| Stembios Technologies, Inc. | Director/Board Member | ||
| Trimax & Cos. Llc | Chairman | ||
| Spatial Digital Systems, Inc. | Director/Board Member | ||
eGTran Corp.
 eGTran Corp. SemiconductorsElectronic Technology eGTran Corp. designs and supplies high-performance broadband connectivity products. The company’s products are used throughout the long haul, metro and access networks, across cable, satellite, telecommunications, data-communications and wireless communications networks. It serves multimedia wireless and fiber optic communication technology industries. eGTran was founded by Frank S. Lee in September 2006 and is headquartered in Taipei, Taiwan. | Semiconductors | Chairman | |
| SHC Consolidated Investors LLC | Chairman | ||
| EZCONN CORPORATION | Electronic Components | Chairman | |
AGC Multi Material America, Inc.
 AGC Multi Material America, Inc. Electronic ComponentsElectronic Technology Part of AGC, Inc. (Japan), AGC Multi Material America, Inc. manufactures and markets printed circuit materials. The company is based in Tempe, AZ. | Electronic Components | President |
Statistics
International
| United States | 11 |
| China | 5 |
| Taiwan | 4 |
| Malaysia | 3 |
| Singapore | 2 |
Sectoral
| Electronic Technology | 10 |
| Consumer Services | 6 |
| Utilities | 2 |
| Technology Services | 2 |
Operational
| Director/Board Member | 8 |
| Corporate Officer/Principal | 5 |
| Chairman | 5 |
| Chief Executive Officer | 3 |
| President | 3 |
Most connected contacts
| Insiders | |
|---|---|
| Steve K. Chen | 10 |
| Zhi Yi Xiao | 8 |
| Jay B. Grover | 4 |
| Kay Lui Weng | 2 |
| David Wilkie | 2 |
| Bob Forcier | 1 |
| Ted Tessier | 1 |
| Bruce Bowers | 1 |
| Janine Schmitz | 1 |
| Marcus Crayon | 1 |
| Greg Marshall | 1 |
| Dawn Cuevas | 1 |
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