Valuation : Tera Probe, Inc.

Market Cap 9.64TCr 63Cr 54Cr 51Cr 46Cr 86Cr 5.93TCr 87Cr 599.34Cr 231.88Cr 3.03TCr 234.82Cr 229.7Cr P/E 2026 *
15.3x
P/E 2027 * 11.5x
Enterprise Value 9.64TCr 63Cr 54Cr 51Cr 46Cr 86Cr 5.93TCr 87Cr 599.34Cr 231.88Cr 3.03TCr 234.82Cr 229.7Cr EV / Sales 2026 *
1.56x
EV / Sales 2027 * 1.21x
Free-Float
36.64%
Yield 2026 *
1.89%
Yield 2027 * 2.64%
1 day+5.19%
1 week+4.01%
Current month-1.59%
1 month-4.29%
3 months+17.49%
6 months+35.32%
Current year+76.98%
1 week 10,400
Extreme 10400
11,660
1 month 9,620
Extreme 9620
13,090
Current year 6,290
Extreme 6290
14,960
1 year 4,605
Extreme 4605
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 01/03/2020
President 59 26/03/2020
Chief Tech/Sci/R&D Officer 56 01/03/2020
Director TitleAgeSince
Director/Board Member 59 01/09/2005
Director/Board Member 55 01/06/2013
Director/Board Member 75 01/09/2005
Change 5-day change 1-year change 3-year change Capi.($)
+5.19%+4.01%+139.53%+155.15% 67Cr
+1.82%+10.59%+107.90%+279.68% 24TCr
+0.83%+4.21%+166.80%+702.13% 16TCr
+4.21%+10.91%+212.92%+273.18% 5.58TCr
+6.17%+18.74%+285.08% - 3.74TCr
-1.12%-5.91%+357.20%+615.13% 2.55TCr
-1.40%-4.99%+76.89%+186.30% 1.34TCr
-5.20%-7.39%+214.04%+273.51% 1.14TCr
-1.65%-3.76%+66.82%+256.87% 1.11TCr
+10.00%+11.43%+347.67%+1,118.35% 808.55Cr
Average +1.83%+3.47%+197.48%+428.92% 5.68TCr
Weighted average by Cap. +1.62%+6.57%+161.94%+433.72%

Financials

2026 *2027 *
Net sales 6.2TCr 40Cr 35Cr 33Cr 30Cr 55Cr 3.81TCr 56Cr 385.35Cr 149.09Cr 1.95TCr 150.98Cr 147.69Cr 8TCr 52Cr 45Cr 42Cr 38Cr 71Cr 4.92TCr 72Cr 497.23Cr 192.37Cr 2.51TCr 194.82Cr 190.56Cr
Net income 630Cr 4.09Cr 3.51Cr 3.3Cr 3.02Cr 5.63Cr 387.33Cr 5.66Cr 39Cr 15Cr 197.97Cr 15Cr 15Cr 840Cr 5.45Cr 4.68Cr 4.41Cr 4.02Cr 7.5Cr 516.44Cr 7.54Cr 52Cr 20Cr 263.97Cr 20Cr 20Cr
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
09/26/09 JP¥11,180.00 +5.47% 24,000
08/26/08 JP¥10,600.00 -6.85% 73,400
07/26/07 JP¥11,380.00 +2.61% 97,000
04/26/04 JP¥11,090.00 +4.72% 57,000
03/26/03 JP¥10,590.00 -1.21% 56,500
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
10,600.00
Average target price
-

Quarterly revenue - Rate of surprise

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