Valuation: Tera Probe, Inc.

Market Cap 11TCr 71Cr 61Cr 57Cr 52Cr 98Cr 6.75TCr 100Cr 671.41Cr 262.51Cr 3.38TCr 265.08Cr 259.32Cr P/E 2026 *
22.5x
P/E 2027 * 18.7x
Enterprise Value 11TCr 71Cr 61Cr 57Cr 52Cr 98Cr 6.75TCr 100Cr 671.41Cr 262.51Cr 3.38TCr 265.08Cr 259.32Cr EV / Sales 2026 *
1.97x
EV / Sales 2027 * 1.6x
Free-Float
36.64%
Yield 2026 *
1.21%
Yield 2027 * 1.42%
1 day-3.82%
1 week+6.47%
Current month+20.49%
1 month+3.52%
3 months+3.61%
6 months+27.98%
Current year+96.03%
1 week 11,450
Extreme 11450
12,840
1 month 8,320
Extreme 8320
13,280
Current year 6,290
Extreme 6290
14,960
1 year 4,120
Extreme 4120
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 01/03/2020
President 59 26/03/2020
Chief Tech/Sci/R&D Officer 56 01/03/2020
Director TitleAgeSince
Director/Board Member 59 01/09/2005
Director/Board Member 55 01/06/2013
Director/Board Member 75 01/09/2005
Change 5-day change 1-year change 3-year change Capi.($)
-3.82%+6.47%+228.02%+207.98% 73Cr
+1.85%+6.63%+132.64%+334.53% 27TCr
+2.47%+17.37%+234.48%+724.89% 17TCr
+3.49%+18.52%+291.92%+330.05% 6.55TCr
+2.43%+6.80%+324.53% - 3.71TCr
+6.90%+6.84%+562.95%+755.93% 2.66TCr
+10.01%+7.01%+141.66%+254.63% 1.42TCr
+7.13%+7.01%+350.49%+342.94% 1.21TCr
+0.61%+2.69%+88.39%+301.42% 991.12Cr
+5.67%+5.67%+83.93%+111.11% 885.97Cr
Average +3.58%+7.57%+243.90%+373.72% 6.09TCr
Weighted average by Cap. +2.41%+7.53%+211.52%+462.12%

Financials

2026 *2027 *
Net sales 5.7TCr 36Cr 31Cr 29Cr 26Cr 50Cr 3.43TCr 51Cr 340.64Cr 133.19Cr 1.72TCr 134.49Cr 131.57Cr 7TCr 44Cr 38Cr 36Cr 32Cr 61Cr 4.21TCr 62Cr 418.33Cr 163.56Cr 2.11TCr 165.16Cr 161.58Cr
Net income 500Cr 3.14Cr 2.71Cr 2.55Cr 2.32Cr 4.36Cr 300.46Cr 4.43Cr 30Cr 12Cr 150.46Cr 12Cr 12Cr 600Cr 3.77Cr 3.26Cr 3.06Cr 2.78Cr 5.23Cr 360.55Cr 5.32Cr 36Cr 14Cr 180.55Cr 14Cr 14Cr
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
17/26/17 JP¥12,350.00 -3.82% 4,15,700
14/26/14 JP¥12,840.00 +7.00% 2,96,000
13/26/13 JP¥12,000.00 +1.95% 2,04,800
12/26/12 JP¥11,770.00 +1.03% 1,23,600
10/26/10 JP¥11,650.00 +0.43% 65,800
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
12,350.00
Average target price
-

Quarterly revenue - Rate of surprise

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