Highlights

12/05 ROHM Co., Ltd. Reports Earnings Results for the Full Year Ended March 31, 2026 CI
28/04 Denso's Fiscal 2026 Profit, Revenue Rise Amid Geopolitical Risks MT
28/04 DENSO Corporation cancelled the acquisition of remaining 95.2% stake in ROHM Co., Ltd.. CI
28/04 ROHM Co., Ltd. Launches Ultra-Compact Wireless Power Chipset For Wearables CI
28/04 Denso Shares Fall on Withdrawal of Planned ROHM Stake Purchase MT
28/04 Denso drops Rohm buyout after failing to win chipmaker's backing RE
28/04 Rohm Co Ltd (update on disclosed matters) - Notice of end of consideration of proposal by Denso Corporation to acquire shares of Rohm Co., Ltd. RE
28/04 Denso Corp - withdrawal of proposal regarding acquisition of shares of Rohm Co RE
27/04 Chipmaker Rohm's Shares Tumble After Denso Considers Withdrawing Takeover Bid DJ
27/04 Rohm Has Not Expressed Support for Denso's Proposal to Acquire Shares MT
27/04 Denso says considers ending Rohm pursuit as acquisition talks stall  RE
27/04 DENSO Corporation Reportedly Mulls Withdrawing Acquisition Offer for Rohm Co CI
25/04 Toyota supplier Denso to withdraw bid for Rohm, Nikkei says RE
31/03 Rohm Co., Ltd. Adds New Lineup of 17 High-Performance Op Amps Enhancing Design Flexibility CI
31/03 Denso CEO Hayashi proposal to acquire Rohm was driven by a stance focused on how to deliver better products to customers in industrial equipment, consumer electronics and automotive sectors RE
31/03 Toyota supplier Denso targets 11% return on equity by 2030 RE
30/03 Final dividend FA
27/03 Mitsubishi Electric, Rohm, Toshiba to Explore Merger of Power Chip Businesses -- Update DJ
27/03 Mitsubishi Electric Joins ROHM, Toshiba in Semiconductor Integration Talks MT
27/03 Mitsubishi Electric, Rohm, Toshiba in Talks to Combine Power Chip Units MT
26/03 Rohm, Toshiba, Mitsubishi Electric to begin power chip integration talks, Nikkei says RE
25/03 Denso Proposes Stake Acquisition in Rohm in Push for Chip Business Expansion MT
18/03 Rohm Semiconductor Introduces Reference Designs for Three-Phase Inverters Featuring New Sic Power Modules CI
13/03 Rohm Says Media Reports On Toshiba Chip Unit Integration Not Confirmed MT
12/03 ROHM Co., Ltd. Begins Online Sales of New SiC Molded Modules: TRCDRIVE pack (TM), HSDIP20 and DOT-247 CI
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