This acquisition is part of the ongoing collaboration between the companies, which began in 2020, in the field of hybrid bonding technology, which has become key for advanced encapsulation processes.
The companies recently extended their partnership to jointly develop the industry's first integrated solution for die-based hybrid bonding equipment. This technology makes it possible to connect chips via direct copper-to-copper links, thus increasing integration density while reducing the length of interconnections between chiplets. The result: increased performance, better energy efficiency and optimized costs—decisive advantages in the era of artificial intelligence.
This is a long-term strategic investment that demonstrates Applied Materials' commitment to co-developing the industry's most efficient hybrid bonding solution, Applied said in its press release.
The transaction was carried out on the markets, without the need for regulatory approval. Applied Materials states that it does not aim to obtain a seat on the BESI board of directors or to acquire additional shares. The European company's stock gained 9% in pre-market trading.
