SK Telecom Co., Ltd. announced it has signed a three-party memorandum of understanding with global server manufacturer Supermicro and global mechanical, electrical and plumbing leader Schneider Electric to develop a total solution for artificial intelligence data centers. The agreement, signed at MWC26, aims to shorten artificial intelligence data center construction timelines and help alleviate supply bottlenecks by leveraging the combined expertise of the three companies. The companies will collaborate on a pre-fabricated modular model that integrates artificial intelligence computing servers with supporting power and cooling infrastructure into a single pre-manufactured module, enabling artificial intelligence data centers to be constructed in a building-block configuration.

Compared with the conventional steel-reinforced concrete method, in which servers and infrastructure are installed sequentially after completion of the data center building, the pre-fabricated modular model offers both faster deployment and improved cost efficiency. In addition, modules can be deployed in phases as demand grows, enhancing scalability while reducing the burden of significant upfront investments and enabling flexible responses to evolving market needs. Under the memorandum of understanding, SK Telecom will contribute its artificial intelligence data center operational expertise; Supermicro will provide high-performance GPU servers optimized for customer-specific artificial intelligence computing scenarios; and Schneider Electric will deliver mechanical, electrical and plumbing infrastructure design and construction capabilities to reliably support large-scale artificial intelligence demand.