Digi International Inc. announced the Digi XBee 3 BLU module. This latest addition to the award-winning Digi XBee family of embedded wireless modules delivers reliable, secure Bluetooth Low Energy (LE) 5.4 connectivity for connected products with provisioning, edge processing, and mobile management capabilities in industrial, healthcare, retail, and smart building applications. Built for reliable operation in harsh environments with an industrial temperature range of -40 degC to 85 degC, the Digi XBee 3 BLU supports Bluetooth LE 5.4 features including enhanced range, improved data throughput, and beaconing capabilities for proximity detection and asset tracking applications.
It is available in two standard Digi XBee form factors (through-hole and micro) and pre-certified to accelerate regulatory approval processes across global markets. The proven Digi XBee ecosystem provides seamless integration across form factors, connectivity technologies, APIs, and software tools. This allows device manufacturers to quickly add intelligent Bluetooth connectivity to their products, without the need for extensive hardware or software redesigns.
Unlike traditional Bluetooth modules that require external microcontrollers, the Digi XBee3 BLU features embedded Micro Python programmability with direct access to on-module I/O (digital I/O, 10-bit ADC inputs) and Bluetooth LE connectivity. This edge processing option allows device manufacturers to implement custom logic, sensor data processing, and decision-making directly on the module -- helping to further reduce design complexity and cost. Security on the Digi XBee 3BLU extends beyond standard Bluetooth module implementations.
Combined with the advanced Bluetooth LE 5.4 security features, like encrypted advertising and its standard secure pairing capabilities, the module includes an additional security layer. Mobile Development Stack: Digi XBee Studio provides device discovery, a console for communication, device configuration, firmware updates, and embedded tools for tasks like XBee profile creation and device recovery. The tool's Quick Setup device reduces development time by providing pre-configured templates for common use cases including beaconing and sensor monitoring.
The Digi XBee Mobile App simplifies field deployment by enabling wireless configuration of settings and over-the-air (OTA) firmware updates directly from iOS and Android devices using Bluetooth. OEMs can now build products that allow customers or technicians to easily discover nearby devices, read sensor data, change configuration parameters, and perform remote maintenance without physical access or specialized equipment. The app includes built-in functionality for beacon scanning, beacon advertising, and phone/tablet communication use cases, enabling immediate testing and deployment of Bluetooth-enabled products.
The Digi IoT Mobile SDK provides complete libraries, code examples, and documentation for creating branded mobile applications that interact with products integrating Digi XBee 3 BL U modules. It accelerates custom mobile application development through the Digi IoT Library for Microsoft .NET MAUI, a framework that enables developers to create a single application and share code between iOS and Android platforms, reducing development time, complexity, and costs. Key Benefits: Standard Digi XBee form factor and APIs for rapid and future-proof integration; Bluetooth Low Energy 5.4 connectivity with advanced beaconing capabilities; Built-in Digi TrustFence device security and strong 256-bit AES encryption; Digi XBee Mobile App for mobile field management capabilities; Digi IoT XBee SDK for accelerated mobile app development and integration; Micro Python environment delivers edge intelligence and simplifies designs; Built-in I/O capabilities enable direct sensor integration and local control; Industrial temperature range (-40 degC to +85 degC) for harsh environments.
