Celestica Inc. announced its DS6000-series 1.6TbE switches are available for order to initial customers. The DS6000-series is available in two versatile form factors to match specific cooling infrastructures: the air-cooled 3RU DS6000 for standard 19-inch racks, and the hybrid-cooled 2OU DS6001 for 21-inch OCP ORv3 environments. Powered by the Broadcom Tomahawk 6 (TH6) switch silicon, the platforms deliver up to 102.4 Tbps of non-blocking switching capacity.
Designed to eliminate bottlenecks in massive AI training clusters, the series features 64 ports of 1.6TbE (OSFP224) connectivity, offering the highest bandwidth density silicon solution available on the market. The high-density 1.6TbE infrastructure is specifically engineered for the critical AI back-end networks of modern ?AI factories,? facilitating seamless scale-up and scale-out networking by leveraging industry standards, including Ultra Ethernet Consortium (UEC) and Open Compute Project (OCP) Ethernet Scale-up Network (ESUN) specifications.
To ensure maximum architectural flexibility, the DS6000-series supports both high-speed copper interconnects and advanced 1.6TbE optical interconnects. The DS6000-series is now available for order. This enables customers to secure high-density 1.6TbE infrastructure essential for scaling their next-generation AI and machine learning clusters.
Celestica will showcase the DS6001 and lead technical discussions on 1.6TbE bandwidth at the upcoming OCP Regional Summit in Barcelona, Spain, from April 29-30.
